木质纤维素纳米纤维PCB基板
Lignocellulose Nanofibril PCB Substrate (LCNF)
Fully biodegradable PCB substrate made from lignocellulose nanofibrils (LCNF) derived from wood biorefinery byproduct. Produced via fibrillation and hornification — a thermal-pressure consolidation process using no synthetic binders. Natural lignin serves as the sole binder. Compostable at end-of-life while allowing separate recovery of metals and components. Flexural strength and electrical properties meet general electronics standards. Functional prototypes include RFID cards and a computer mouse. Developed under EU Horizon Europe HyPELignum project at Empa, Switzerland.
- 类别
- Bio-based Composite / Natural Fibre Material
- 生物降解
- Fully compostable after end-of-life; natural composting with separate metal/component recovery
- 拉伸强度
- 63 MPa
- 电学性能
- Volume resistivity 9×10³ Ω·cm at 85% RH (meets cellulose PCB standard ≥10³ Ω·cm); Thermal stability: decomposition onset 205°C; Dimensional stability ≤0.5%
- 耐水性
- Moisture sensitivity — inherent to biodegradability, requires protective design for humid environments
- TRL · BioNexus 评估
- TRL 4
制备方法
LCNF fibrillation (10 kWh/kg) → hornification (30–120°C, 50–1500 kN) → inkjet printing of conductive traces. No synthetic resin/binders; natural lignin as sole binder.