HyPELignum——木基混合印刷电子

HyPELignum — Wood-Based Hybrid Printed Electronics

HyPELignum is an EU Horizon Europe project combining hybrid printed electronics with forest-based materials to demonstrate consumer electronics with net-zero carbon emissions. Wood-derived materials are used both as substrates and as ink components, conductive inks are formulated from abundant transition metals instead of silver, and sensing, communication and energy-storage components are additively manufactured and integrated into three demonstrators. The consortium also develops an energy-efficient microchip for system management and recycling routes that recover both the wood fraction and the electronic materials. Sustainability analysis — life cycle, toxicity and biodegradability — feeds a decision-making tool for designing green, circular electronics.

主要特点

工作原理

Additively manufactured electronics on forest-based substrates. Lignocellulose substrates replace FR-4 and PET; inks based on abundant transition metals replace silver. Printed sensors, communication and energy-storage units are integrated with a low-power management chip. Sustainability is assessed across life cycle, toxicity and biodegradability rather than claimed.

可持续性影响

Targets net-zero carbon consumer electronics and reduced e-waste by making the substrate itself renewable and recyclable. Funded by the European Union under Horizon Europe Grant Agreement no. 101070302; started 2022-10-01, 48 months, total budget EUR 6.2 million.

牵头机构: Research Institutes of Sweden (RISE) — project coordinator

项目来源